COMh-sdID (E2) New
COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family
Specifications
- Size D form factor – 160 x 160 mm
- Intel Xeon D-2700 / D-2800 Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations - up to 100GbE
- Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.
The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.
Downloads
技术参数
Datasheet COMh-sdID
[ comh-sdid_datasheet.pdf, 320.59 KB, Feb.19.2024 ]
参考手册
COMh-sdID User Guide
[ comh-sdid_user_guide_rev1-0.pdf, 1.49 MB, Jul.04.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
白皮书
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
The new Standard COM-HPC – Delivering future proofed power and connectivity
[restrictions apply]
In response to the growing high performance computing requirements and to ensure Computer-on-Modules remain fit-for-purpose long into the future, a new High Performance Computing standard for Modules has been defined by the PICMG: COM-HPC®. This enables more powerful COMs that extend beyond the limits and capabilities of COM Express® (Type 6 and 7) and other COM standards.
While complementary, COM-HPC® is distinct from COM Express®, directly supporting the growing need for more powerful future-proofed compute, scalability, transmission, and network performance.
Tech Spec Sheet
COM-HPC Tech Specs
[ techspec_com-hpc.pdf, 2.02 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
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COMh Eval Carrier Server
HST01-0000-10-0 |
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COMh Eval Carrier Server | more |
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HSP COMh-sdID (E2) thread HSD01-0000-99-0 |
Heatspreader for COMh-sdID commercial and E2, threaded mounting holes | ||
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HSP COMh-sdID (E2) through HSD01-0000-99-1 |
Heatspreader for COMh-sdID commercial and E2, through holes | ||
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COMh Size D Active Uni Cooler (w/o HSP) HSD99-0000-99-0 |
COM-HPC Size D Universal Active Cooler for Heatspreader Mounting (160 x 100 x 46 mm) | ||
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COMh Size D Passive Uni Cooler (w/o HSP) HSD99-0000-99-1 |
COM-HPC Size D Universal Passive Cooler for Heatspreader Mounting (160 x 100 x 46 mm) | ||
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COMh Mounting Kit HXX17-0000-00-0 |
COM-HPC Universal Mounting Kit | ||
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DDR4-3200 LRDIMM 128GB ECC_SDID 97102-1232-SDID |
DDR4-3200, 128GB, 288P, PC4-3200 LRDIMM, ECC | ||
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DDR4-3200 RDIMM 64GB ECC_SDID 97100-6432-SDID |
DDR4-3200, 64GB, 288P, PC4-3200 RDIMM, ECC | ||
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DDR4-3200 RDIMM 32GB ECC_SDID 97100-3232-SDID |
DDR4-3200, 32GB, 288P, PC4-3200 RDIMM, ECC | ||
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DDR4-3200 RDIMM 16GB ECC_SDID 97100-1632-SDID |
DDR4-3200, 16GB, 288P, PC4-3200 RDIMM, ECC | ||
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DDR4-3200 LRDIMM 128GB ECC E2_SDID 97103-1232-SDID |
DDR4-3200, 128GB, 288P, PC4-3200 LRDIMM, ECC, industrial temperature | ||
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DDR4-3200 RDIMM 64GB ECC E2_SDID 97101-6432-SDID |
DDR4-3200, 64GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature | ||
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DDR4-3200 RDIMM 32GB ECC E2_SDID 97101-3232-SDID |
DDR4-3200, 32GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature | ||
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DDR4-3200 RDIMM 16GB ECC E2_SDID 97101-1632-SDID |
DDR4-3200, 16GB, 288P, PC4-3200 RDIMM, ECC, industrial temperature |
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