This latest COM Express module extends Kontron’s product family of server-class COM platforms. The COMe-cDV7 is the smaller version of the COMe-bDV7 (COM Express basic) – dedicated for use in extremely space-constraint applications. The COMe-cDV7 module features server-grade CPU performance with up to 16 cores and two SODIMM sockets for up to 2x 32GB DDR4 memory offering a well-balanced core count vs memory size implementation. Available interfaces are up to 14x PCIe Gen 3.0 lanes, up to 3x USB 3.0, 2x SATA Gen3, 2x UARTs and optionally support of eMMC 5.1. In combination with the up to four 10GbE-KR ports the COMe-cDV7 is ideally suited for network intensive implementations. The KR design allows for maximum flexibility by defining the physical interface – KR for backplane connectivity, Copper (RJ45) or fibre (SFP+) on the base board. Furthermore the available NC-SI signals allow the connection of a Baseboard Management Controller (BMC) on the baseboard for the purpose of enabling out-of-band remote manageability. This enhances reliability and helps reduce the overall operating cost in general.
An added advantage for developers is the optional integration of Kontron’s embedded Security Solution APPROTECT based on WIBU Systems technology.
Learn more about the security solution Kontron APPROTECT here: Security Solution - APPROTECT
Compliance | COM Express® compact, Pin-out Type 7 - COM.0 R3.0 |
Dimensions (H x W x D) | 95 x 95 mm |
CPU | Commercial temperature: Intel® Atom® Processor C3958, 16C, 2.0GHz, 31W TDP Intel® Atom® Processor C3858, 12C, 2.0GHz, 25W TDP Intel® Atom® Processor C3758, 8C, 2.2GHz, 25W TDP Intel® Atom® Processor C3538, 4C, 2.1GHz, 15W TDP Industrial temperature: Intel® Atom® Processor C3808, 12C, 2.0 GHz, 25 W TDP Intel® Atom® Processor C3708, 8C, 1.7 GHz, 17 W TDP Intel® Atom® Processor C3508, 4C, 1.5 GHz, 11 W TDP Intel® Atom® Processor C3308, 2C, 1.6 GHz, 9 W TDP |
Panel signal | - |
Audio | - |
Main Memory | 2x DDR4 SODIMM for up to 64 GByte ECC / non ECC |
Graphics Controller | - |
Chipset | Integrated in SoC |
Ethernet | 1x 10/100/1000 MBit Ethernet Up to 4x 10GbE Interfaces (KR) – depending on C3000 SKU NC-SI support |
Ethernet Controller | Intel® I210IT (uses one lane of PCIe 3.0) - 1 GbE Intel® Quad LAN integrated in SoC - up to 4x 10 GbE |
Hard Disk | Up to 2x SATA3, 6Gb/s |
Options | eMMC 5.x up to 64 GByte pSLC or 128GByte MLC (build option) |
PCI Express / PCI support | Up to 14x PCIe 3.0 lanes - depending on C3000 SKU |
USB | Up to 3x USB3.0 / 4x USB2.0 (3x USB2.0 with WIBU security chip) |
Serial | 2x serial interface (RX/TX only) |
Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC |
BIOS | AMI UEFI |
Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Power Management | ACPI 5.0 |
Power Supply | ATX, 8.5 V – 20 V Wide Range, Single Supply Power |
Special Features | Trusted Platfom Module TPM 2.0 Security Chip for Kontron security stack- APPROTECT |
Operating System | Linux, Windows® Server 2012 / 2012 R2 / 2016, Windows® 7, VxWorks 7 |
Temperature | Commercial temperature 0 - 60 °C Industrial temperature -40 °C to +85 °C (specified SKUs only) |
Supported Modules | COMe-cDV7 COMe-cDV7 E2 |
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
Datasheet COMe-cDV7
[ come-cdv7_20190524_datasheet.pdf, 2.7 MB, Oct.21.2019 ]
COMe-cDV7 (E2) User Guide
Rev. 1.3
Aug. 01, 2022
[ come-cdv7_user-guide_rev-1-3_2021-08-01-w2016.pdf, 2.08 MB, Apr.20.2023 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM EXPRESS® compact
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
COMe Eval Carrier T7 68300-0000-00-0 |
Evaluation Board for COM Express® Pin-out Type 7 Computer-on-Modules | ||
ADA-COME-T7 4X10G RJ45 - DEV-TOOL 68300-0000-01-0 |
COMe Type 7 Interposer Card, 4x 10GbE RJ45 adapter to be used in combination with COMe Eval Carrier T7 Please see CUSTOMER SECTION for more information |
||
HSP COMe-cDV7 thread 66003-0000-99-0 |
Heatspreader for COMe-cDV7 threaded mounting holes | ||
HSP COMe-cDV7 through 66003-0000-99-1 |
Heatspreader for COMe-cDV7 through mounting holes | ||
COMe Passive Uni Cooler (w/o HSP) 36099-0000-99-1 |
COM Express® Universal Passive Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <10W) | ||
COMe Active Uni Cooler (w/o HSP) 36099-0000-99-0 |
COM Express® Universal Active Cooler for Heatspreader Mounting (87x78x14.3mm) (for CPU's <20W) | ||
DDR4-2400 SODIMM 4GB_COM7 97020-0424-COM7 |
DDR4-2400, 4GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB E2_COM7 97021-0424-COM7 |
DDR4-2400, 4GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB ECC_COM7 97030-0424-COM7 |
DDR4-2400, 4GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 4GB ECC E2_COM7 97031-0424-COM7 |
DDR4-2400, 4GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB_COM7 97020-0824-COM7 |
DDR4-2400, 8GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB E2_COM7 97021-0824-COM7 |
DDR4-2400, 8GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB ECC_COM7 97030-0824-COM7 |
DDR4-2400, 8GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 8GB ECC E2_COM7 97031-0824-COM7 |
DDR4-2400, 8GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB_COM7 97020-1624-COM7 |
DDR4-2400, 16GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB E2_COM7 97021-1624-COM7 |
DDR4-2400, 16GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB ECC_COM7 97030-1624-COM7 |
DDR4-2400, 16GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 16GB ECC E2_COM7 97031-1624-COM7 |
DDR4-2400, 16GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB_COM7 97020-3224-COM7 |
DDR4-2400, 32GB, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB E2_COM7 97021-3224-COM7 |
DDR4-2400, 32GB, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB ECC_COM7 97030-3224-COM7 |
DDR4-2400, 32GB, ECC, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 | ||
DDR4-2400 SODIMM 32GB ECC E2_COM7 97031-3224-COM7 |
DDR4-2400, 32GB, ECC, E2, 260P, 1200MHz, PC4-2400 SODIMM for COMe-cDV7, COMe-bDV7, COMe-bBD7 |
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