COMe-bTL6 (E2)
COM Express® Basic Type 6 with 11th Generation Intel® Core™ / Xeon® Processors
Specifications
- Up to 128 GByte DDR4 memory
- Up to 2.5 Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade versions
The COM Express® COMe bTL6-H (Tiger Lake-H) CPUs are featuring up to 8 cores and are specifically suited for demanding Edge workloads and high-end, high-bandwidth applications. Intel® Iris® XeGraphics supports up to four independent 4K displays or one 8K HDR display. AI-workloads in machine vision or medical applications reach new levels of performance with the GPU and Intel® Deep Learning Boost. Integrated TSN- and Intel® TCC-functionality enable deterministic networks in Industry 4.0 as well as various real-time applications.
The TDP of the processor chips ranges from 25 to 45 watts, with eight processing cores enabling clock frequencies of up to 5.0 GHz. A maximum of three DDR4 SO-DIMM sockets allow a memory expansion of up to 96 GBytes (non-ECC/ECC). With integrated Intel® UHD graphics supporting up to four independent 4K displays, up to 40 HD video streams can be processed and analyzed in parallel at 1080p/30fps resolution. In addition, fast 2.5 GBit Ethernet with Time Sensitive Networking (TSN) and Intel® Time Coordinated Computing (Intel® TCC) predestines the module for demanding real-time applications.
As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally used, which enables highly effective data processing even under harsh conditions. The COMe-bTL6 (E2) module guarantees full computing power even in extreme industrial environments with temperatures ranging from -40 °C to +85 °C and offers a higher number of application-ready integrated features and more powerful cooling compared to alternative smaller form factor designs.
Features
| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® 11th Generation CoreTM / Xeon® family For details see table (CPU variants) given below |
| Chipset | HM570E, QM580E and RM590E |
| Main Memory | 2x DDR4 SODIMM dual channel up to 64 GByte ECC or non ECC (optional 3rd SODIMM socket for 96 GByte) |
| Graphics Controller | Intel® Iris®Xe Graphics on i7/i5 processors Intel® xxx Graphics on i3/Xeon® processors |
| Ethernet Controller | Intel® I225LM/I225IT |
| Ethernet | Up to 2.5Gb Ethernet with TSN & WOL support (depending on SKU) |
| Storage | 4x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express | 8x PCIe 3.0 (8GT/s), Default configuration 8x1, optional 1x4 + 4x1, 2x4 etc. 1x16 PCIe 4.0 on PEG Lanes #0-3 |
| Display | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.2; 8x USB 2.0 |
| Serial | 2x serial interface (RX/TX only) |
| Audio | High Definition Audio interface |
| Special Features | Trusted Platform Module TPM 2.0 (G)SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC, support of Intel® OptaneTM memory technology via PCIe ON REQUEST: vPRO (AMT/TXT/AES Support), eDP instead of LVDS, up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI Flash |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| BIOS | AMI UEFI |
| Operating System | Windows® 10, Linux, VxWorks |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
技术参数
COMe-bTL6 (E2) Datasheet
[ come-btl6_datasheet.pdf, 2.58 MB, Jul.25.2023 ]
参考手册
COMe-bTL6 User Guide
Rev. 2.3
May. 24, 2024
[ come-btl6_user-guide_rev-2-3_2024-05-24.pdf, 2.71 MB, May.24.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
白皮书
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
应用案例
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
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COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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HSP COMe-bTL6 Cu-core threaded 38038-0000-99-0 |
Heatspreader for COMe-bTL6 Cu-core threaded mounting holes | ||
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HSP COMe-bTL6 Cu-core through 38038-0000-99-1 |
Heatspreader for COMe-bTL6 Cu-core through holes | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-3200 SODIMM 4GB_BTL6 97020-0432-BTL6 |
DDR4-3200, 4GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 8GB_BTL6 97020-0832-BTL6 |
DDR4-3200, 8GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 16GB_BTL6 97020-1632-BTL6 |
DDR4-3200, 16GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 32GB_BTL6 97020-3232-BTL6 |
DDR4-3200, 32GB, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 4GB E2_BTL6 97021-0432-BTL6 |
DDR4-3200, 4GB, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 8GB E2_BTL6 97021-0832-BTL6 |
DDR4-3200, 8GB, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 16GB E2_BTL6 97021-1632-BTL6 |
DDR4-3200, 16GB, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 32GB E2_BTL6 97021-3232-BTL6 |
DDR4-3200, 32GB, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 4GB ECC_BTL6 97030-0432-BTL6 |
DDR4-3200, 4GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 8GB ECC_BTL6 97030-0832-BTL6 |
DDR4-3200, 8GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 16GB ECC_BTL6 97030-1632-BTL6 |
DDR4-3200, 16GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 32GB ECC_BTL6 97030-3232-BTL6 |
DDR4-3200, 32GB, ECC, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 4GB ECC E2_BTL6 97031-0432-BTL6 |
DDR4-3200, 4GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 8GB ECC E2_BTL6 97031-0832-BTL6 |
DDR4-3200, 8GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 16GB ECC E2_BTL6 97031-1632-BTL6 |
DDR4-3200, 16GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM | ||
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DDR4-3200 SODIMM 32GB ECC E2_BTL6 97031-3232-BTL6 |
DDR4-3200, 32GB, ECC, E2, 260P, 1600MHz, PC4-3200 SODIMM |
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