COMe-bCL6
COM Express® Basic Type 6 with 8th/9th Generation Intel® Core™ / Xeon® Processors
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Specifications
- Intel® 8th/9th Generation Core™ series / Xeon® E family with CM246/QM370 PCH
- Up to 128 GByte DDR4 non-ECC/ECC memory
- Optional NVMe SSD onboard
- Industrial grade versions
- Support of Kontron’s Embedded Security Solution (APPROTECT)
The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor.
Through the use of consistent COM Express connectors and feature implementation, the COMe-bCL6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.
Especially the introduction of a hexa core CPU, memory expansion to possible 128GB, additional NVMe SSD onboard and the continuation of the Intel® Optane™ fast memory support for system acceleration shall be a differentiator to former applications.
Typical application areas can be found in markets such as communication, digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as industrial plant and machine line control on shop floor- and control room-level.
In addition the rugged R E2S modules – which offer Rapid shutdown functionality, ECC memory support and industrial grade temp. range usage – meet the special requirements of applications for the Military/Defense and Transportation market.
Features
| Compliance | COM Express® basic, Pin-out Type 6 |
| Dimensions (H x W x D) | 125 x 95 mm |
| CPU | Intel® Xeon® 8th Gen E-2176M, 6x 2.7/4.4 GHz, GT2, 45/35W 9th Gen E-2276ME, 6x 2.8/4.5 GHz, GT2, 45W/35W 9th Gen E-2276ML, 6x 2.0/4.2 GHz, GT2, 25W 9th Gen E-2254ME, 4x 2.6/3.8 GHz, GT2, 45W/35W 9th Gen E-2254ML, 4x 1.7/3.5 GHz, GT2, 25W Intel® Core™ 8th Gen i7-8850H, 6x 2.6/4.3 GHz, GT2, 45/35W 8th Gen i5-8400H, 4x 2.5/4.2 GHz, GT2, 45/35W 8th Gen i3-8100H, 4x 3.0/- GHz, GT2, 45/35 W 9th Gen i7-9850HE, 6x 2.7/4.4 GHz, GT2, 45W/35W 9th Gen i7-9850HL, 6x 1.9/4.1 GHz, GT2, 25W 9th Gen i3-9100HL, 4x 1.6/2.9 GHz, GT2, 25W Intel® Celeron® 9th Gen G4930E, 2x2.4/- GHz, GT2, 35W 9th Gen G4932E, 2x1.9/- GHz, GT2, 25W |
| Chipset | Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™) |
| Main Memory | Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request) |
| Graphics Controller | Intel® UHD Graphics P630 for Xeon® processor Intel® UHD Graphics 630 for Core™ processors Intel® UHD Graphics 610 for Celeron® processors |
| Ethernet Controller | Intel® I219LM |
| Ethernet | 10/100/1000 MBit Ethernet |
| Hard Disk | 4x SATA 6Gb/s |
| Flash Onboard | Up to 1 TByte NVMe SSD (on request) |
| PCI Express / PCI support | 8x PCIe x1, 1x PEG x16 |
| Panel signal | DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit |
| USB | 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0 |
| Serial | 2x serial interface (RX/TX only |
| Audio | Intel® High Definition Audio |
| Common Features | SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe |
| BIOS | AMI Aptio V |
| Humidity | 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78) |
| Options | vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, Intel® Mobile HM370 Chipset, 3rd/4th DDR4 SO-DIMM socket, NVMe SSD |
| Power Management | ACPI 6.0 |
| Power Supply | 8.5 V – 20 V Wide Range, Single Supply Power |
| Special Features | POSCAP capacitors, Trusted Platfom Module TPM 2.0, Security Chip, 4k Resolutions, Flexible PEG lane configuration by Setup Option, Rapid shutdown (R E2S variants) |
| Operating System | Windows® 10, Linux, VxWorks |
| Temperature | Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating |
| Supported Modules | COMe-bCL6(R E2S) xx-xxxxx CM246/QM370 |
Downloads
Solution Brief
Intel Solution Brief: Computer-on-Module Flexibility at the Edge
Kontron COM Express® and COM-HPC® modules with 13th Gen Intel® Core™ mobile processors deliver powerful performance, AI, and graphics with portfolio flexibility for industrial-grade deployments.
[ 18933-1-intel-rpl-p-kontron-solution-brief-v4.pdf, 1.67 MB, Mar.03.2023 ]
技术参数
COMe-bCL6
[ come-bcl6_datasheet.pdf, 2.51 MB, Feb.28.2022 ]
参考手册
COMe-bCL6 User Guide
Rev. 2.3,
Oct. 05 2023
[ come-bcl6_user-guide_rev2-3_2023-10-05.pdf, 3.88 MB, Oct.18.2024 ]
General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]
白皮书
Modules and Motherboards WP [restrictions apply]
Robotic-Assisted Surgery White Paper [restrictions apply]
应用案例
Autonomous Driving
Read how our COM Express® Module is working perfect for application from b-plus with its flexibility, bandwith, reliability and the required graphics.
[ uc_b-plus_eu.pdf, 4.78 MB, May.26.2021 ]
The tough choice of Processors
Solving challenges in selecting computer boards & modules for IIoT projects. In this article we support you to make the right choice for your application: To find the best balance of processing power, graphics capabilities and connectivity on the one hand and size, power consumption, and cost on the other.
[ artikel_processor-choice_eu-1-.pdf, 4.42 MB, Apr.20.2023 ]
COM Express® Basic for Autonomous Transportation in Rugged Environments
Implementing Kontron’s latest COMe® Basic based on Intel’s® 11th generation Xeon® processors and ECC memory provided the optimum power and performance
[ adas_en_use-case_kontron.pdf, 1.54 MB, Oct.11.2022 ]
Tech Spec Sheet
Tech Specs COM EXPRESS®
[ tech-spec_comexpress.pdf, 7.08 MB, Apr.04.2024 ]
Services
Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]
More Downloads
All other downloads such as drivers, bios, drawings etc. are available on Kontron’s Customer Section
Accessories
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COMe Eval Carrier2 T6
38116-0000-00-5 |
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COM Express® Eval Carrier2 Type 6 with 5mm COMe connector | more |
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HSP COMe-bSL6/bKL6/bCL6 Cu-core threaded 38030-0000-99-0 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core threaded mounting holes | ||
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HSP COMe-bSL6/bKL6/bCL6 Cu-core through 38030-0000-99-1 |
Heatspreader for COMe-bSL6/COMe-bKL6/COMe-bCL6 Cu-core through holes | ||
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HSK COMe-basic active (w/o HSP) 38025-0000-99-0C05 |
Active Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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HSK COMe-basic passive (w/o HSP) 38025-0000-99-0C06 |
Passive Cooler for COMe-bxL6/bV26/bDV7/bID7 to be mounted on HSP | ||
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DDR4-2666 SODIMM 32GB_COM 97017-3200-27-0 |
DDR4-2666, 32GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 16GB_COM 97017-1600-27-0 |
DDR4-2666, 16GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 8GB_COM 97017-8192-27-0 |
DDR4-2666, 8GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 4GB_COM 97017-4096-27-0 |
DDR4-2666, 4GB, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 32GB E2_COM 97017-3200-27-2 |
DDR4-2666, 32GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 16GB E2_COM 97017-1600-27-2 |
DDR4-2666, 16GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 8GB E2_COM 97017-8192-27-2 |
DDR4-2666, 8GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 4GB E2_COM 97017-4096-27-2 |
DDR4-2666, 4GB, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 32GB ECC_COM 97018-3200-27-0 |
DDR4-2666, 32GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 16GB ECC_COM 97018-1600-27-0 |
DDR4-2666, 16GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 8GB ECC_COM 97018-8192-27-0 |
DDR4-2666, 8GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 4GB ECC_COM 97018-4096-27-0 |
DDR4-2666, 4GB, ECC, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 32GB ECC E2_COM 97018-3200-27-2 |
DDR4-2666, 32GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 16GB ECC E2_COM 97018-1600-27-2 |
DDR4-2666, 16GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 8GB ECC E2_COM 97018-8192-27-2 |
DDR4-2666, 8GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM | ||
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DDR4-2666 SODIMM 4GB ECC E2_COM 97018-4096-27-2 |
DDR4-2666, 4GB, ECC, E2, 260P, 1333MHz, PC4-2666 SODIMM |
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