IoT

One of the new challenges arising with the use of edge, fog, and cloud architectures is the connection of components to each other and to the public cloud. An important element of developing a solution capturing all pieces is the IoT framework susietec

At the field, or edge level, data is collected by industrial computers, e.g. by gateways, which process, filter, analyze and act on these data in real-time right at the device.

Edge, fog and cloud applications demand increasing computing power. The interfaces to sensors or machines often require non-standard solutions. Especially in smaller machines, space is limited or restricted in some dimension and need a special solution.

Today, the connection from the sensor device to the embedded cloud takes place via real-time data communication, on sensor and edge level - for example Industrial Ethernet or fieldbuses - and gateways , which provide the transformation of real time data into the informational area.

资源

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3.5"-SBC-WLU

3.5" Single Board Computer with 8th Generation Intel® Core™ U-Series Processors

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Specifications

1x LVDS, 2x DP++ for triple display support
2x GbE LAN for Ethernet
4x USB 3.2 Gen 2, 4x USB 2.0, 2x RS232/422/485 for USB & serial device connection
8x DIO for device / signal control
1x SATA 3.0, 1x M.2 Key B, 1x M.2 Key E, 1x M.2 Key M for storage & expansion

Download Datasheet

More Connected Platform for IoT Applications

3.5”-SBC-WLU is a 3.5" single board computer based on 8th Generation Intel® Core™ U-Series processors. Besides computing / graphics performance enhancement, the board supports many new-generation interfaces, including (1) faster DDR4 memory sockets; (2) HDMI- / DVI-output-supported DP++ ports; (3) high-speed SATA 3.0 drive socket; and (4) highly-integrated M.2 expansion slots.

Most importantly, 3.5”-SBC-WLU supports Intel® Wireless-AC via new Intel's new CNVi interface integrated in the M.2 Key E socket, which can deliver up to 12x faster Wi-Fi speeds depending on the model that is installed when compared to legacy Wi-Fi devices. It is a more connected embedded computing platform ideal for IoT wireless applications.

Features

Processor

Intel® Core™ i7-8665UE
(Quad Core, 8M Cache, 1.7 / 4.4 GHz, FCBGA1528, 15 W TDP)
Intel® Core™ i5-8365UE
(Quad Core, 6M Cache, 1.6 / 4.1 GHz, FCBGA1528, 15 W TDP)
Intel® Core™ i3-8145UE
(Dual Core, 4M Cache, 2.2 / 3.9 GHz, FCBGA1528, 15 W TDP)
Intel® Celeron® 4305UE
(Dual Core, 2M Cache, 2.00 GHz, FCBGA1528, 15 W TDP)

Main Memory

2x DDR4 2400 1.2 V SO-DIMM up to 64 GByte (Core™ i models)
2x DDR4 2133 1.2 V SO-DIMM up to 64 GByte (Celeron® models)

Graphics Controller

Intel® UHD Graphics 620 (Core™ i models)
Intel® UHD Graphics 610 (Celeron® models)

Display

1x LVDS (24-bit, 2-ch, 1920 x 1200 @ 60 Hz)
2x DP++ (4096 x 2304 @ 60 Hz, on rear)
Triple Display

Audio Controller

Realtek ALC888S

Audio

1x Speaker-out (Stereo, 3 W)
1x Line-in (by header)
1x Line-out (by header)
1x Mic-in (by header)

Ethernet

2x GbE LAN (RJ45 on rear, Intel® I219-LM, Intel® I210-AT)

USB	4x USB 3.2 Gen 2 (Type A on rear) 4x USB 2.0 (by header)

Serial

2x RS232/422/485 (by header)

SATA	1x SATA 3.0

Expansion

1x M.2 Key B (Type 2242, w/ PCIe x1 / USB 2.0 / USB 3.2 / UIM)
1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0 / CNVi)
1x M.2 Key M (Type 2280 / 2242, w/ PCIe x4 / SATA 3.0)
1x SIM Card Holder (Micro type)

Input Voltage

DC 12 V

Power connector

1x4-pin pitch 3.0 mm Wafer

BIOS	AMI uEFI BIOS w/ 256 Mb SPI Flash

Watchdog

Programmable WDT to generate system reset event

Cooling

1x Wafer for Smart Fan

Operating System

Windows 10, Linux

Form Factor

ECX (146 mm x 105 mm / 5.75" x 4.13")

Operating Temperature

0 °C ~ 60 °C / 32 °F ~ 140 °F

Humidity

0 % ~ 95 %

Compliance

CE Class B, FCC Class B

Downloads

技术参数

3.5"-SBC-WLU Datasheet
Revision 20240902, September 2, 2024
[ kontron-3d5-sbc-wlu-datasheet-20240902.pdf, 3.12 MB, Sep.02.2024 ]

参考手册

3.5"-SBC-WLU User Guide
Revision 2.1, September 2, 2024
[ kontron-3d5-sbc-wlu-user-guide-rev-2d1-2024-09-02.pdf, 1.77 MB, Sep.02.2024 ]

General Safety Instruction
[ general-safety-instructions.pdf, 628.88 KB, Aug.02.2024 ]

快速查询手册

3.5"-SBC-WLU Quick Installation Guide
Revision 2, February 26, 2020
[ kontron-3d5-sbc-wlu-qig-20200226.pdf, 456.14 KB, Feb.26.2020 ]

Tech Spec Sheet

Tech Specs SBC 候选发布版本(RC)
Revision 20241014, October 14, 2024
[ 3d5-sbc-tech-spec-sheet-20241014.pdf, 19.83 MB, Nov.04.2024 ]

Services

Kontron Services Brochure
[ kontron-services-brochure.pdf, 8.9 MB, Dec.17.2020 ]

Variants

3.5"-SBC-WLU-0-i5-8365UE 43015-0000-16-4	$3.5\$	Intel® Core™ i5-8365UE
3.5"-SBC-WLU-1-i3-8145UE 43015-0000-22-2	$3.5\$	Intel® Core™ i3-8145UE
3.5"-SBC-WLU-2-i7-8665UE 43015-0000-17-4	$3.5\$	Intel® Core™ i7-8665UE
3.5"-SBC-WLU-3-4305UE 43015-0000-20-2	$3.5\$	Intel® Celeron® 4305UE

Accessories

Heatsink - Cooling Solution 1067-5535		Heatsink with Fan, 15W tdp
DC Jack Cable 1064-2433		2.5 DC Jack with 2 mm Nut and 0.5 mm Washer to1x4P 3.0 pitch, L=300 mm Part No.: 0C5020000004220L
COM_Port Cable 1064-2427		D-SUB 9P (male) to 1x10P 1.25 pitch, L=350 mm
DIO Cable 1065-3137		D-SUB-9P(Female) to 1x10P 1.25 pitch, L=200mm
2 Ports USB 2.0 Cable 1064-2429		USB (female) ×2 to 2×5P 2.54 pitch, L=250 mm
SATA Cable with Lock 1064-2431		SATA Cable with Lock, 1X7P (1.27 pitch), L=460 mm
SATA Power Cable 1064-2430		SATA Power Cable, SATA 1x15P Pitch:1.27mm to PH 2.0 HSG 1x4P 2.0pitch, L=460mm
Audio Cable 1064-2432		2x6P 2.54 pitch to ear phone jack x3 3.5 pitch, L=350 mm